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3D Integration for VLSI Systems
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| #3360997 in Books | 2011-09-26 | Original language:English | PDF # 1 | 9.50 x6.50 x1.00l,1.10 | File type: PDF | 350 pages||||"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great referen
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.
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